Please upload your talks before meeting starts

TRD-2D weekly

Europe/Bucharest
Conference room Building A (DFH)

Conference room Building A

DFH

Alexandru Bercuci (IFIN-HH)
Description

  Weekly reports on local activities done for the TRD-2D project of the CBM collaboration.

Meeting Access Information

FEE ASIC - FASP

- design agreed with company (Swiss). Wait for the price offer.

- Europractice need to discuss the production of 500 FASP chips. A possible deadline for bonded chips at home 01-2023.

FEE ASIC - ADC

- ADC design on progress - to be presented as block diagram

- CADENCE simulations were started, even corners

- CADENCE MC not started

- first MWPR targeted to second part of 2023

FEE DAQ - GETS

- test board for bonded FASP, with 2 components, a bare tester and an DAQ board

- 32 ch ADC (Texas Inst). Not on the market (Estimate 04-05 2023)

- for the test board we might try other solutions and nothing found on the market.

Chamber construction - Not discussed

- To be followed : HC for back-plane and C-foil (100 um) for EW (Mariana)

System integration - Not discussed

Software - Not discussed

- Adriana is testing the SW for mCBM analysis

TRD2D Physics performances - Not discussed

- reconstructed variables are introduced in teh pT-y (PID) plot

aob

- elect responsible persons for each activity

There are minutes attached to this event. Show them.