TRD-2D weekly
Conference room Building A
DFH
Weekly reports on local activities done for the TRD-2D project of the CBM collaboration.
Meeting Access Information
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Meeting ID: 826 8725 7222
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Passcode: 723781
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Direct Link : https://us02web.zoom.us/j/82687257222
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FEE ASIC - FASP
- design agreed with company (Swiss). Wait for the price offer.
- Europractice need to discuss the production of 500 FASP chips. A possible deadline for bonded chips at home 01-2023.
FEE ASIC - ADC
- ADC design on progress - to be presented as block diagram
- CADENCE simulations were started, even corners
- CADENCE MC not started
- first MWPR targeted to second part of 2023
FEE DAQ - GETS
- test board for bonded FASP, with 2 components, a bare tester and an DAQ board
- 32 ch ADC (Texas Inst). Not on the market (Estimate 04-05 2023)
- for the test board we might try other solutions and nothing found on the market.
Chamber construction - Not discussed
- To be followed : HC for back-plane and C-foil (100 um) for EW (Mariana)
System integration - Not discussed
Software - Not discussed
- Adriana is testing the SW for mCBM analysis
TRD2D Physics performances - Not discussed
- reconstructed variables are introduced in teh pT-y (PID) plot
aob
- elect responsible persons for each activity