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TRD-2D weekly

Europe/Bucharest
Conference room Building A (DFH)

Conference room Building A

DFH

Alexandru Bercuci (IFIN-HH)
Description

  Weekly reports on local activities done for the TRD-2D project of the CBM collaboration.

Meeting Access Information

FEE ASIC - FASP - not discussed

- design agreed with company (Swiss). Wait for the price offer.

- Europractice need to discuss the production of 500 FASP chips. A possible deadline for bonded chips at home 01-2023.

FEE ASIC - ADC

- 9 bits useful + 3 aux

- speed 4 Msample/s

- comparator (COMP) with "aproximatii succesive", one per clock cycle

- CADENCE simulation for the Sample and Hold Component (SHC).

- first chip will be single channel, MWPR targeted to second part of 2023

- testing further components ...

FEE DAQ - GETS

- test board for bonded FASP, with 2 components, a bare tester and an DAQ board

- 8 chs ADC identified

Chamber construction

- The first try was unsuccessful due to the long time between wire winding and mounting on the detector

- The winding machine has a lot of errors. There are two directions to fix it:

  - change the 3-phase input current

  - discuss with East-electric for a possible fixture of the machine

- The 1.5 mm wire comb has be finished and is on the way to Buch.

- Manual for the wire machine update (1 week)

- To be followed : HC for back-plane and C-foil (100 um) for EW (Mariana)

System integration - not discussed

- Thursday 9:00 meeting

Software - Not discussed

- Adriana is testing the SW for mCBM analysis

TRD2D Physics performances - Not discussed

- reconstructed variables are introduced in teh pT-y (PID) plot

aob

 

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