TRD-2D weekly
Conference room Building A
DFH
Weekly reports on local activities done for the TRD-2D project of the CBM collaboration.
Meeting Access Information
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Meeting ID: 826 8725 7222
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Passcode: 723781
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Direct Link : https://us02web.zoom.us/j/82687257222
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FEE ASIC - FASP - not discussed
- design agreed with company (Swiss). Wait for the price offer.
- Europractice need to discuss the production of 500 FASP chips. A possible deadline for bonded chips at home 01-2023.
FEE ASIC - ADC
- 9 bits useful + 3 aux
- speed 4 Msample/s
- comparator (COMP) with "aproximatii succesive", one per clock cycle
- CADENCE simulation for the Sample and Hold Component (SHC).
- first chip will be single channel, MWPR targeted to second part of 2023
- testing further components ...
FEE DAQ - GETS
- test board for bonded FASP, with 2 components, a bare tester and an DAQ board
- 8 chs ADC identified
Chamber construction
- The first try was unsuccessful due to the long time between wire winding and mounting on the detector
- The winding machine has a lot of errors. There are two directions to fix it:
- change the 3-phase input current
- discuss with East-electric for a possible fixture of the machine
- The 1.5 mm wire comb has be finished and is on the way to Buch.
- Manual for the wire machine update (1 week)
- To be followed : HC for back-plane and C-foil (100 um) for EW (Mariana)
System integration - not discussed
- Thursday 9:00 meeting
Software - Not discussed
- Adriana is testing the SW for mCBM analysis
TRD2D Physics performances - Not discussed
- reconstructed variables are introduced in teh pT-y (PID) plot
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